Properly developed resistance joining assures the lowest leak rates through the devices life cycle. MCL utilizes on site metrology tools including Hitachi SEM, Olympus Opto-Digital Microscope, Real-Time X-Ray and Mitutoyo CNC measuring for process development.
Automatic Dry Gross and Fine Leak Testing including data of all leak testing for each package type to 10-12 atm-cm3/sec Helium
Incoming Clean; Class 1 Cleanroom Processing; Sealing in < Class 1 Particulate with 0.1 PPM H2O and O2 Inert Gas Environment
Clean, Low Cost MCL Carriers (Patent Pending) provide secure edge grip carrying and process self-centering for all cover seal processes including gross and fine leak testing.
Success for Widest Variety of Package, Cover and Feedthrough Requirements