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Hermetic Package Sealing:
Design, Develop, Produce Pilot to HVM

MCL’s hermetic package sealing processes provide air leak rates E10 atm-cm3/sec, magnitudes lower than MIL-STD-883 Test Method 1014 for Aerospace Class K Devices. 

Complete process services for new product development or process improvement is provided.  For properly developed resistance joining, MCL’s on site metrology tools include Hitachi SEM, Olympus Opto-Digital Microscope, Real-Time X-Ray and Mitutoyo CNC measuring.

For leak rate testing, MCL test equipment includes Fully Automatic, Single System Gross and Fine Leak Detection, with complete data collection on all tests.

All packages are sealed either on parallel seam sealers or one-shot resistance welders.  Processes are supported on all equipment manufacturers.  MCL’s process warranty is provided for the life of your product.  The process is transferable to other manufacturers, including MCL for pilot production.

Management

During Rich Richardson’s 28 years with Solid State Equipment Corporation (acquired by VEECO in 2015) he advanced new product development programs for worldwide customers. Rich has extensive experience in processing, equipment and manufacturing expertise in BEOL and Assembly packaging for Compound Semiconductor, Photonics, Advanced Packaging, MEMs, Microwave, Power and Semiconductor devices. Prior to SSEC, Rich held positions with IBM ROLM Systems and Philips NV. He is a University of Michigan graduate.

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