80Au20Sn Solder Cover Sealing
Ceramic packages with tungsten film and an Au/Ni top plate are routinely sealed with 80Au20Sn solder with a pre-attached preform to an Au/Ni plate Kovar cover. In addition to obtaining lowest leak rates, sealed packages are x-ray inspected to determine compliance with MIL-STD-883 Test Method 2012.9 Rejection Criteria for Cover Seal Voids relevant to 80Au20Sn Solder Cover Seal processing.
High Voiding 80Au20Sn Solder Cover Seal Joining
Low Voiding 80Au20Sn Solder Cover Seal Joining
Lowest Leak Rates with Highest Yielding Manufacturing Process
MCL’s 80Au20Sn cover sealing solution includes the tooling and machine parameters for a
process with widest processing margins.