Hermetic Package Sealing Solutions


MicroCircuit Laboratories provides customized development and production services for component level, low temperature hermetic package encapsulation and testing.   Process deliverables exceed space level hermetic packaging requirements including leak testing, external visual testing, 80Au20Sn solder void testing, particle testing in addition to specific device, package and feedthrough stress requirements. 

MCL’s capability includes materials design, class 10 cleanroom, pre-seal moisture removal processing, headspace control with inert 0.1 PPM H2O and O2; parallel seam sealing, testing with automated gross and fine leak testing, Particle Impact Noise Detection, Hitachi SEM, Real Time X-Ray, Olympus Opto-Digital Microscope, Mitutoyo CNC Measuring.

All processes may be easily transferred to captive or merchant partners.


Rich Richardson is president of MicroCircuit Laboratories (MCL), which provides development, problem resolution, and prototyping services for Hi-Rel component-level hermetic package sealing. Over the course of more than three decades in the industry, Rich has developed expertise in processing with weld/braze or 80Au20Sn solder hermetic cover sealing for package configurations including compound semiconductors, photonics, MEMs, microwave, power, and multi-chip modules.

Prior to MCL, Rich worked for 28 years at Solid State Equipment Corporation (SSEC), which was acquired by Veeco in 2015. Prior to SSEC, Rich was with IBM ROLM Systems and Philips NV. He is a graduate of the University of Michigan.