Hermetic Package Sealing:
Design, Develop, Produce Pilot to HVM
MicroCircuit Laboratories provides development and pilot production services for component level, low temperature, hermetic package encapsulation and test processes, from initial design through all phases of production. Processes are delivered with E-10 atm-cm3/sec air leak rates, a magnitude lower than the most critical Aerospace requirements per MIL-STD 883 Test Method 1014 Seal.
MCL’s capability includes materials design software, class 1 cleanroom processing, pre-seal moisture removal processing, low temperature hermetic package sealing with parallel seam sealing or one-shot low temperature resistance joining, inert environmental processing with 0.1 PPM H2O and O2, automatic gross and fine leak detection and Particle Impact Noise Detection. On site metrology includes Hitachi SEM, GT Real Time X-Ray, Olympus Opto-Digital Microscopes, Mitutoyo CNC Measuring.
All processes are easily transferred to captive or merchant production partners.
During Rich Richardson’s 28 years with Solid State Equipment Corporation (acquired by VEECO in 2015) he advanced new product development programs for worldwide customers. Rich has extensive experience in processing, equipment and manufacturing expertise in BEOL and Assembly packaging for Compound Semiconductor, Photonics, Advanced Packaging, MEMs, Microwave, Power and Semiconductor devices. Prior to SSEC, Rich held positions with IBM ROLM Systems and Philips NV. He is a University of Michigan graduate.