Hermetic Package Sealing Solutions
MicroCircuit Laboratories provides complete customized developmental and prototyping services for component level hermetic package encapsulation. Sealed packaged leak rates are decade+ lower than the most stringent MIL-STD-883 Test Method 1014 Seal for Class K devices. Whether problem resolution, new product development or prototyping, MCL provides vertically integrated capability for rapid turn times.
MCL’s onsite capability include tooling fabrication, class 10 cleanroom processing, pre-seal package particle clean and moisture removal processing; parallel seam sealing for Weld / Braze and 80Au20Sn Solder cover sealing; One Shot Welding for TO packages; automatic, single system dry gross and fine leak testing; PIND testing, Hitachi SEM; GT Real Time X-Ray, Olympus Opto-Digital Microscopes; Mitutoyo CNC Measuring and more.
All processes are transferred to captive or merchant customers.
Rich Richardson is president of MicroCircuit Laboratories (MCL), which provides development, problem resolution, and prototyping services for Hi-Rel component-level hermetic package sealing. Over the course of more than three decades in the industry, Rich has developed expertise in processing with weld/braze or 80Au20Sn solder hermetic cover sealing for package configurations including compound semiconductors, photonics, MEMs, microwave, power, and multi-chip modules.
Prior to MCL, Rich worked for 28 years at Solid State Equipment Corporation (SSEC), which was acquired by Veeco in 2015. Prior to SSEC, Rich was with IBM ROLM Systems and Philips NV. He is a graduate of the University of Michigan.