Contact: Microcircuit Laboratories | microcircuitlabs.com
Microcircuit Laboratories (MCL) presented a technical paper titled Advancements in Low Temperature Hermetic Sealing at the iMAPS New England 52nd Symposium & Expo on May 12, 2026.
The presentation explored the process and equipment evolution for seam weld and seam solder hermetic cover sealing, providing attendees with a detailed understanding of modern encapsulation techniques.
“Understanding how seam weld and seam solder processes have evolved over time gives engineers a much deeper appreciation for where hermetic packaging stands today,” said Rich Richardson of Microcircuit Laboratories. “We are now leveraging industrial automation controls to achieve the highest levels of technical capability and reliability within high-volume production environments. AI plays a critical role in our processes, helping us deliver the lowest cost in hermetic packaging without compromising quality.”
MCL continues to invest in advanced sealing technologies and automation to support the growing demand for reliable, cost-effective hermetic packaging solutions.
About Microcircuit Laboratories
Microcircuit Laboratories (MCL) specializes in hermetic packaging and microelectronic assembly services. For more information, visit microcircuitlabs.com.