[Dallas, TX, August 4, 2025] – MicroCircuit Laboratories (MCL) is proud to announce that the United States Patent & Trademark Office (USPTO) has reported its intention to award MCL the first of what is likely to be many U.S. patents directed to its innovative Robotic Cover Sealer (RCS). The RCS is designed to provide the highest performing hermetic seals of microelectronic packages, and delivers fully automatic processing in one streamlined operation. The seamless transition from one package to another is facilitated through an easy-to-use PC program, eliminating the need for special tools or fixtures.
Earlier this month, the USPTO issued a notice to MCL indicating that patent claims directed to several aspects of MCL’s proprietary sealing system technology have been allowed. The soon-to-be-patented technology includes, among other things, MCL’s proprietary vision system and hold-down mechanism, which cooperate to ensure that covers are properly placed and oriented prior to sealing. One of the exclusive features of the RCS is its ability to deliver hermetic seals with zero gross leaks and fine leak rates that are a decade slower than current industry specifications. The full automation of the RCS will lower the cost of hermetic packaging in a high mix, hi-rel package manufacturing operation.
MCL Chairman Rich Richardson said, “We’re pleased that the U.S. patent office has acknowledged the innovative and valuable nature of our RCS technology. We expect this first patent to issue within the next few months. And we look forward to developing a considerable patent portfolio directed to all aspects of our leading edge technology.”
Interested parties can contact MCL directly or visit www.microcircuitlabs.com for more information.
About MCL
MicroCircuit Laboratories (MCL) is a leader in hi-rel packaging solutions, offering complete services and equipment to support our customers’ hi-rel manufacturing needs. With a focus on innovation, quality, and cost-effectiveness, MCL continues to lead the industry forward with hermetic package sealing solutions.
For media inquiries, please contact:
Rich Richardson
[email protected]
https://microcircuitlabs.com/