Patented RCS automates Hi-Rel microelectronic package hermetic seam sealing, package and lid materials handling while removing the dependency on skilled manual operators
KENNETT SQUARE, Pa. — September 23, 2026 — MicroCircuit Laboratories LLC (MCL), a specialist in low-temperature hermetic microelectronic packaging, today announced production volumes of its Robotic Cover Sealer (RCS), a new generation of seam seal specifically developed for high-reliability (Hi-Rel) microelectronic packaging.
The RCS automates the seam sealing process, including seam seal self teach on the first or every package in a seal lot. As packages are near finished goods at package seal, package handling from standard manufacturing tools eliminates open package handling outside or inside the glovebox. Lid pick and place utilizes AI to learn and adapt lid placement – which is critical for highest seal yields of photoetched “stepped” and flat lids..
“Hermetic package seam sealing has been one of the last manual bottlenecks in Hi-Rel packaging,” said Rich Richardson, Chairman of MicroCircuit Laboratories. “The RCS brings together automation and sealing precision so our customers can scale high-mix production without scaling headcount with the skills they can’t hire.”
Capabilities
- AI-driven teaching. The entire seam seal process and materials handling process are automated. AI insures each package is handled and sealed perfectly.
- Toolless transitions. A PC program moves the system from one package configuration to the next with no special tools, fixtures, or jigs.
- Seal performance. The RCS delivers hermetic seals with zero gross leaks and fine leak rates a decade slower than current industry and aerospace specifications. Yields routinely are 99.99%
- Patent protection. The U.S. Patent & Trademark Office has awarded MCL U.S. Patent #12,451,377 covering the RCS, including its proprietary vision system and hold-down mechanism that confirms cover placement before sealing. Additional patents are in process.
Process and production support
MCL backs the hardware with vertically integrated, end-to-end support.
- Robotic Cover Sealer is an open platform design: Highest performance industrial automation is standard, including Beckhoff controls with Twin Cat; Festo Motor Controllers; Cognex Vision Systems.
- Custom process development. MCL designs the workflow and delivers a verified Process of Record (POR) for both seam weld and seam AuSn solder hermetic seals.
- Standards compliance. Seals are developed to meet or exceed MIL-STD-883 and MIL-STD-750 test methods.
- In-house testing. Automated pre-seal deep vacuum bakes, optical and digital microscopy, X-ray and SEM with EDS, PIND, and Internal Vapor Analysis (RGA).
- Lifetime warranty. All hermetic seals and automated processes developed by MCL are warranted for the life of the package.
The RCS is available now. MCL is offering complimentary prototype runs for manufacturers evaluating the system’s throughput and cost impact.
About MicroCircuit Laboratories LLC
Founded in 2015 and headquartered in Pennsylvania’s Brandywine River Valley, MicroCircuit Laboratories delivers low-temperature hermetic package sealing across development, prototyping, production, and equipment. MCL serves the photonics, quantum, and Hi-Rel markets — including LiDAR, single-photon detectors, atomic clocks, cryogenic assemblies, MMIC, GaN, and power and legacy packages — from a Class 10 cleanroom, with a technical staff carrying 35+ years of hermetic cover sealing experience.
Media Contact
Rich Richardson, Chairman
MicroCircuit Laboratories LLC
T: 610.228.0161
F: 610.228.0162
rich@microcircuitlabs.com
https://microcircuitlabs.com/