MCL Tooling


MCL Process Carriers for hermetic microelectronic packages can be used on OEM processing equipment, including the specific cover seal, gross and fine leak process cluster. MCL carriers typically weigh 35 grams, are easy to handle and configured in a variety of cassettes sized by specific manufacturing requirements. MCL carriers are fabricated by precision laser cutting, providing unmatched economics and customization, whether for single or multiple packages or configuration as trays for multi-step precision assembly operations.