MicroCircuit Laboratories, the global leader is process solutions for hermetic package sealing, today announces the order placement of an automated hermetic package sealing system. The system provides full automation of the sealing process including lid pick and place.
“Our customers have a high mix of hermetic package configuration which are near finished goods at the hermetic package encapsulation process.” said Rich Richardson of MicroCircuit Laboratories. “MCL will now be able to provide complete hermetic cover seals for hundreds of package seals per day. When combined with our A5 flexible test method, customers may accompany their product to MCL and depart with fully sealed and tested packages. Full implementation will be completed in Q1 2022.”
