Weld / Braze Cover Sealing
For lowest peak device temperature, hermetic cover seal with resistance joining of Kovar™ 29=Ni/17-Co/Bal Fe alloy, with CTE of 6 PPM, is utilized. The process enables full management of the headspace. As the heat for the joining is formed at the point of contact, the internal device, feedthrough and package temperature is low; there is no contamination generated during the sealing process.
Highest manufacturing yields, with very tight deviations, are routinely realized with virtually no gross leakers and with fine leak rates significantly slower than required by Test Method 1014K. Seal joint quality exceeds Test Method 2009 External Visual.