Hermetic Package Leak Rates

Hermetic Cover Seal Development, Prototyping & Support

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The component level, hermetic microelectronic package maintains an internal atmosphere where the transfer of fluids and gases is prevented over time.  Most common exposure to this technology is attributed to a problem.  MCL is an expert in understanding and providing solutions for the microelectronic component hermetic package.  Specifically, the sealing of covers to packages with low thermal impact which will not cause distortion to package and feed throughs nor heat the internal devices and materials.

  • Package & Cover, Feedthrough Design
  • Seam Weld Cover Joining Development
  • Seam AuSn Solder Cover Joining Development
  • Tooling for Weld and AuSn Cover Joining
  • A5 Gross and Fine Leak Testing
  • Sealed Package Headspace Development
  • Expert Equipment and Process Support
 Space SealMCL Seal
0.42 cm3
1E-8 atm-cm3/sec Air2E-10 atm-cm3/sec Air
0.58 cm3
1E-8 atm-cm3/sec Air4.4E-10 atm-cm3/sec Air
0.68 cm3
1E-8 atm-cm3/sec Air2E-10 atm-cm3/sec Air
6.48 cm3
1E-8 atm-cm3/sec Air1.6E-9 atm-cm3/sec Air
0.05 cm3
1E-9 atm-cm3/sec Air4.4E-10 atm-cm3/sec Air
0.0002 cm3 | 80Au20Sn
1E-9 atm-cm3/sec Air1E-10 atm-cm3/sec Air
0.005 cm3 | 80Au20Sn
1E-9 atm-cm3/sec Air1E-10 atm-cm3/sec Air
0.008 cm3 | 80Au20Sn
1E-9 atm-cm3/sec Air1E-10 atm-cm3/sec Air
0.02 cm3
1E-9 atm-cm3/sec Air1E-10 atm-cm3/sec Air
0.05 cm3
1E-9 atm-cm3/sec Air4.8E-10 atm-cm3/sec Air