Hermetic Package Leak Rates
Hermetic Cover Seal Development, Prototyping & Support
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The component level, hermetic microelectronic package maintains an internal atmosphere where the transfer of fluids and gases is prevented over time. Most common exposure to this technology is attributed to a problem. MCL is an expert in understanding and providing solutions for the microelectronic component hermetic package. Specifically, the sealing of covers to packages with low thermal impact which will not cause distortion to package and feed throughs nor heat the internal devices and materials.