MCL will customize services through the entire hermetic package sealing process, from design through problem resolution, for both seam weld and seam AuSn cover sealing. MCL’s vertical integration provides the most rapid turn times. We fabricate tooling and capabilities including automated optical and digital microscopes, X-Ray, SEM with EDS, sample preparation including an ion mill, Seam Weld and Seam AuSn Hermetic Cover sealers in automated glovebox systems with deep vacuum bake, automated gross and fine leak testing, mechanical testing, PIND, internal vapor analysis and more.
For automated gross and fine leak testing, multiple automated helium bomb stations enable processing of multiple lots simultaneously. All processes developed by MCL are warrantied for the life of the package.
Whether re-purposing of COTS for Aerospace and Hi-Rel applications, including ATF-2023-1935, or new product development, MCL’s development services provide performance surpassing MIL-STD-883 Test Methods for MicroCircuits and MIL-STD-750 for Semiconductor Devices. These MIL-STD-883 Test Methods include 1014; 1018; 2002; 2009; 2012; 2020; 2016. MIL-STD-750 Test Methods include 1071; 1018; 2016; 2076; 2052; 2066; 2071. As part of service, MCL can assist in referring to services for complete, certified DLA testing per MIL-STDs.
Package & Cover Assembly Design will lower your hermetic packaging costs. New product development, low yield or down manufacturing, supply chain management issues and more are resolved and enhanced by MicroCircuit Laboratories.
