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Patented RCS automates Hi-Rel microelectronic package hermetic seam sealing, package and lid materials handling while removing the dependency on skilled manual operators KENNETT SQUARE, Pa. — September 23, 2026 — MicroCircuit Laboratories LLC (MCL), a specialist in low-temperature hermetic microelectronic packaging, today announced production volumes of its Robotic Cover Sealer

Contact: Microcircuit Laboratories | microcircuitlabs.com Microcircuit Laboratories (MCL) presented a technical paper titled Advancements in Low Temperature Hermetic Sealing at the iMAPS New England 52nd Symposium & Expo on May 12, 2026. The presentation explored the process and equipment evolution for seam weld and seam solder hermetic cover sealing, providing

[Dallas, TX, August 4, 2025] – MicroCircuit Laboratories (MCL) is proud to announce that the United States Patent & Trademark Office (USPTO) has reported its intention to award MCL the first of what is likely to be many U.S. patents directed to its innovative Robotic Cover Sealer (RCS). The RCS is designed

[Dallas, TX, May 27, 2025] – MCL is proud to announce production volumes of its innovative Robotic Cover Sealer (RCS), designed to provide the highest performing hermetic seals of microelectronic packages. The RCS delivers fully automatic processing in one streamlined operation. The seamless transition from one package to another is