[Dallas, TX, August 4, 2025] – MicroCircuit Laboratories (MCL) is proud to announce that the United States Patent & Trademark Office (USPTO) has reported its intention to award MCL the first of what is likely to be many U.S. patents directed to its innovative Robotic Cover Sealer (RCS). The RCS is designed to provide the highest performing […]

[Dallas, TX, May 27, 2025] – MCL is proud to announce production volumes of its innovative Robotic Cover Sealer (RCS), designed to provide the highest performing hermetic seals of microelectronic packages. The RCS delivers fully automatic processing in one streamlined operation. The seamless transition from one package to another is facilitated through an easy-to-use PC

Microcircuit Laboratories (MCL) is pleased to announce that Herman Itzkowitz is joining MCL as the Chief Technology Officer (CTO). Herman will lead the development and implementation of MCL’s technology to deliver innovation and enhance customer deliverables. “We are thrilled to have Herman on board as our new CTO,” Says MCL’s Rich Richardson. “With his 25 years

MicroCircuit Laboratories, the global leader in process solutions for hermetic package sealing, is now making available hermetic packaging services for “Expanding Space Design Options Using COTS” “We are excited to offer services to assist in the repurposing of COTS into Hi-Rel Hermetic Packaging, suitable for Aerospace and other mission critical applications. MCL offers a complete

MicroCircuit Laboratories announces multiple, high-impact customer orders for the design, development, prototyping and production for new photonic devices with high performance microelectronic packaging. “We are excited to participle in the mission to design, develop, prototype, and produce new high performance photonic packages for telestial and space applications. MCL’s processing in our Class 10 cleanroom enables