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Media, Announcements, & Industry Updates
MCL Announces 2024 Q1 availability of the Robotic Cover Sealer, RCS, patent pending
“From our founding in 2015, Microcircuit Laboratories mission is to deliver the highest performance hermetic package sealing process. We continue this mission by supporting our
December 15, 2023
MCL Announces Services for “Expanding Space Design Options Using COTS”
MicroCircuit Laboratories, the global leader in process solutions for hermetic package sealing, is now making available hermetic packaging services for “Expanding Space Design Options Using
December 4, 2023
MCL Announces Major Orders For High Performance Packaging for New Telestial & Space Photonic Devices
MicroCircuit Laboratories announces multiple, high-impact customer orders for the design, development, prototyping and production for new photonic devices with high performance microelectronic packaging. “We are
August 10, 2023