[Dallas, TX, August 4, 2025] – MicroCircuit Laboratories (MCL) is proud to announce that the United States Patent & Trademark Office (USPTO) has reported its intention to award MCL the first of what is likely to be many U.S. patents directed to its innovative Robotic Cover Sealer (RCS). The RCS is designed to provide the highest performing […]

[Dallas, TX, May 27, 2025] – MCL is proud to announce production volumes of its innovative Robotic Cover Sealer (RCS), designed to provide the highest performing hermetic seals of microelectronic packages. The RCS delivers fully automatic processing in one streamlined operation. The seamless transition from one package to another is facilitated through an easy-to-use PC

[Kennett Square, PA, January 6, 2025 ] – MicroCircuit Laboratories (MCL) HDHS Technology is now available to deliver miniature hermetic assemblies with large area feedthroughs in packages and covers, including multi-layer ceramic substrate packaging and integrated heat sinks.  Hi-Rel packaging is now available with lower costs, including 99.9% seal yield guarantee and full automation production equipment.