MCL Announces Major Orders For High Performance Packaging for New Telestial & Space Photonic Devices

MicroCircuit Laboratories announces multiple, high-impact customer orders for the design, development, prototyping and production for new photonic devices with high performance microelectronic packaging.

“We are excited to participle in the mission to design, develop, prototype, and produce new high performance photonic packages for telestial and space applications. MCL’s processing in our Class 10 cleanroom enables the cleanest head space with the highest performance, customized hermetic seals.” says Rich Richardson. “Our deliverables exceed all space specifications while simultaneously reducing the customer’s engineering resources for hermetic cover seal and test.”