Hermetic Cover Sealing
0 gross and lowest fine leak rates
- Low Temperature
- Controlled Head Space
- Seam Weld & AuSn Sealing
- Package, Cover & Feedthrough Design
Customized Development Solutions
MicroCircuit Laboratories (MCL) is the industry process expert for seam weld and seam AuSn hermetic package cover sealing. Our services range from development to problem resolution and production, with deliverables tailored to your specific needs. All sealing processes far exceed industry specifications and are backed by a lifetime warranty.
MCL is equipped to deliver hermetic packaging expertise for a wide variety of technologies, markets and applications.
- Compound Semiconductors
- Photonics
- MEMs
- Advanced Packaging
- GaAs
- Indium Phosphide
- GaN
- MCM
- Hi-Rel
- Sensors
- 5G
- Medical
Development
Whether you’re looking for new product development or problem resolution, MCL’s services are customized to your needs. We offer on-site metrology tools, automatic gross and fine leak testing systems, design modeling and more – all coupled with package sealing expertise and delivered with rapid turn times.
Production Services
MCL provides tailored production services, even given tight deadlines. Data files are provided on all networked equipment, including seal processing and test. Hard copy workflow instructions accompany each individual lot. Testing data includes package serial numbering.
Customized Services to Suit Your Needs
How can we help you with new product development or problem resolution?
