Package & Cover Assembly Design

MCL’s deliverables for new product design, supply chain management or resolving manufacturing yield problems, our expert design services for package and cover, including feedthroughs and materials selection, have you covered. Deliverables will meet test methods of MIL-STD-883 for Microcircuits and MIL-STD-750 for Semiconductor Devices. MCL’s software package enables the highest quality and lowest cost of hermetic packaging.

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